Mxm Electro Spec
This document was uploaded by user and they confirmed that they have the permission to share it. If you are author or own the copyright of this book, please report to us by using this DMCA report form. Report DMCA
Overview
Download & View Mxm Electro Spec as PDF for free.
More details
- Words: 5,678
- Pages: 51
Loading documents preview...
Specification MXM Graphics Module Mobile PCI Express Module Electromechanical Specification
SP-01106-001_v1.0 May 2004
Document Change History
Version
Date
1.0
05/14/04
SP-01106-001_v1.0
Reason for Change Initial Release
i 05/14/04
Table of Contents Document Change History.............................................................................................. i Overview .......................................................................................................................1 Key Features ..................................................................................................................... 1 Configurations ................................................................................................................... 2 Display Options ................................................................................................................. 2 MXM Display options...................................................................................................... 3 IGP and MXM .................................................................................................................... 3 Mechanical Specifications .............................................................................................4 Mechanical Description....................................................................................................... 4 Mounting and Retention ....................................................................................................12 MXM Compatibility ............................................................................................................12 Mechanical .......................................................................................................................12 Keep Out Definitions .........................................................................................................12 Z-Height Restrictions ....................................................................................................13 Surface Keep Outs........................................................................................................15 Mechanical Keep Out Drawings..........................................................................................16 MXM Module Keep Outs ................................................................................................17 Mechanical Requirements..................................................................................................30 Backing Plate ...............................................................................................................30 Thermal Solution Mounting ...........................................................................................30 Electrical Specifications...............................................................................................31 PCI Express Support .........................................................................................................31 Electrical Connector ..........................................................................................................31 Connector Pin Descriptions................................................................................................37 Power Requirements.........................................................................................................39 Power Throttling...............................................................................................................40 System Requirements .......................................................................................................40 Display Requirements ...................................................................................................40 Other Requirements .....................................................................................................41 Additional Function Support...............................................................................................42
SP-01106-001_v1.0
ii 05/14/04
Appendix: Support Information ..................................................................................43 Configuring Notebook for MXM with IGP ............................................................................43 Configurable Option......................................................................................................43 Upgradeable Option......................................................................................................44
SP-01106-001_v1.0
iii 05/14/04
List of Figures Figure 1.
Display Options ................................................................................................. 3
Figure 2.
MXM Form Factor .............................................................................................. 5
Figure 3.
MXM-I Topside.................................................................................................. 6
Figure 4.
MXM-II Topside................................................................................................. 7
Figure 5.
MXM-II Backside ............................................................................................... 8
Figure 6.
MXM-III Topside ..............................................................................................10
Figure 7.
MXM-III Backside .............................................................................................11
Figure 8.
MXM Side View, Top and Backside Height Restrictions for MXM Modules..............16
Figure 9.
MXM-I Top Surface Keep Outs ..........................................................................17
Figure 10.
MXM-I Bottom Surface Keep Outs .....................................................................18
Figure 11.
MXM-II Top Surface Keep Outs .........................................................................19
Figure 12.
MXM-II Bottom Surface Keep Outs ....................................................................20
Figure 13.
MXM-III Top Surface Keep Outs ........................................................................21
Figure 14.
MXM-III Bottom Surface Keep Outs ...................................................................22
Figure 15.
MXM-I Z-Height Restriction Zones .....................................................................23
Figure 16.
MXM-II Topside Z-Height Restriction Zones........................................................24
Figure 17.
MXM-II Bottomside Z-Height Restriction Zones...................................................25
Figure 18.
MXM-III Topside Z-Height Restriction Zones ......................................................26
Figure 19.
MXM-III Topside Z-Height Restriction Zones (Continued)....................................27
Figure 20.
MXM-III Topside Z-Height Restriction Zones (Continued)....................................28
Figure 21.
MXM-III Bottomside Z-Height Restriction Zones .................................................29
Figure 22.
MXM Connector Motherboard Footprint..............................................................32
Figure 23.
MXM Connector Top Down and Side View ..........................................................33
Figure 24.
MXM Card Edge Finger Pattern..........................................................................34
Figure 25.
Notebook Output Topology with IGP .................................................................44
Figure 26.
Notebook Output Topology with IGP .................................................................44
SP-01106-001_v1.0
iv 05/14/04
List of Tables Table 1.
Board Configurations ......................................................................................... 2
Table 2.
MXM Display Options ......................................................................................... 2
Table 3.
Height Restrictions ...........................................................................................15
Table 4.
Connector Pinout..............................................................................................35
Table 5.
Connector Pin Descriptions ...............................................................................37
Table 6.
Power Requirements ........................................................................................39
SP-01106-001_v1.0
v 05/14/04
Overview
The Mobile PCI Express Module (MXM) is a consistent graphics interface for PCI Express notebooks. The specification describes the electromechanical interfaces including feature set, dimensions, connector pinouts and electrical interfaces for each MXM Graphics Module™. The MXM graphics modules consist of a standard single 230-pin edge connector in which all Input/Outputs are routed through.
Key Features
SP-01106-001_v1.0
Low cost Small size Scalable performance 16 lane PCI Express support LVDS panel support Dual DVI support VGA support Video out support Upgradeable graphics
1 05/14/04
MXM Electromechanical Specification
Configurations Table 1 lists the dimensions and maximum power for the three MXM graphics module types.
Table 1.
Board Configurations
MXM Type
Width
Length
Power
MXM-I
70 mm
68 mm
Up to 18 W
MXM-II
73 mm
78 mm
Up to 25 W
MXM-III
82 mm
100 mm
Up to 35 W
Display Options Table 2 lists the MXM graphics boards display options.
Table 2.
MXM Display Options
Display Options
SP-01106-001_v1.0
MXM Display Solutions
VGA
Routed to either VGA or DVI-I connectors on motherboard
Two single-link DVI or one dual-link DVI
DVI routed to connector on motherboard and/or through docking station
Video out
Video out routed to connector on motherboard, Supports Composite, S-Video and HDTV
Single dual-link LVDS
LVDS routed to connector on the motherboard.
2 05/14/04
MXM Electromechanical Specification
MXM Display options MXM is capable of supporting the following interfaces: One dual-link LVDS panel display One TV output One VGA output One dual-link TMDS or two single-link TMDS outputs to DVI
All interfaces are routed through the MXM’s connector to the motherboard (Figure 1). TVOut
VGA DVI (2 Single or 1 dual Link)
MXM L V D S
Figure 1.
Display Options
IGP and MXM The MXM platform has been designed to co-exist with Integrated Graphics Processors (IGP). An IGP notebook designed to support MXM graphics modules can be populated with or without a MXM graphics card. If no MXM graphics module is present, installation of a loop through card is required to complete circuit paths for LVDS signals and enable panel operation.
SP-01106-001_v1.0
3 05/14/04
Mechanical Specifications
Mechanical Description The MXM-I and MXM-II form factors (Figure 2 through Figure 5) accommodate GPUs up to 35 mm × 35 mm in size. The four holes surrounding the GPU are used to mount the thermal solution. The two holes on the far end of the board are for stand-offs to mount to the notebook.
SP-01106-001_v1.0
4 05/14/04
MXM Electromechanical Specification
Figure 2.
SP-01106-001_v1.0
MXM Form Factor
5 05/14/04
MXM Electromechanical Specification
Figure 3.
SP-01106-001_v1.0
MXM-I Topside
6 05/14/04
MXM Electromechanical Specification
Figure 4.
SP-01106-001_v1.0
MXM-II Topside
7 05/14/04
MXM Electromechanical Specification
Figure 5.
SP-01106-001_v1.0
MXM-II Backside
8 05/14/04
MXM Electromechanical Specification
The MXM-III form factor (Figure 6 and Figure 7) will accommodate GPUs up to 40 mm × 40 mm in size. The four holes surrounding the GPU are used to mount the thermal solution. The two holes on the far end of the board are for stand-offs to mount to the notebook.
SP-01106-001_v1.0
9 05/14/04
MXM Electromechanical Specification
Figure 6. SP-01106-001_v1.0
MXM-III Topside 10 05/14/04
MXM Electromechanical Specification
Figure 7.
SP-01106-001_v1.0
MXM-III Backside
11 05/14/04
MXM Electromechanical Specification
Mounting and Retention The MXM mounts to the notebook‘s motherboard through a 230-pin right angle edge connector. The connector on the MXM is a card-edge connector consisting of only the PCB with plated contacts. The MXM graphics module is inserted at a 20 to 30 degree angle and then rotated towards the motherboard and then screwed into mechanical mounting stand-offs. The stand-offs will maintain separation from the motherboard and also assist in the retention of the MXM. The stand-off locations will be the same for all MXM graphics modules to allow one motherboard to support the three MXM graphics module types.
MXM Compatibility The MXM has been designed to allow for compatibility between the three MXM graphics module types. The notebook’s mounting holes for the MXM are in the same location for all MXM graphics modules. MXM-I can insert into all notebooks that support MXM graphics modules. MXMII can insert into notebooks that support MXM-II and MXM-III modules. MXMIII modules only insert into notebooks that support a MXM-III module volumetric keep outs. MXM-III thermal solutions are incompatible with MXM-I and MXM-II. MXM-III accommodates a maximum of a 40 mm × 40 mm GPU package where as MXM-I and MXM-II support a maximum of a 35 mm × 35 mm GPU package.
Mechanical Keep Out Definitions Each of the three Mobile PCI Express modules (MXM) has distinct mechanical keep out zones. These keep out zones are a combination of z-height restrictions and surface keep outs on the MXM PCB. The keep outs are necessary for system and thermal solution integration compatibility. These surface keep out volumes are designed to accommodate thermal solutions that dissipate the maximum power a particular MXM graphics module is designed for and to allow mechanical compatibility between modules with an integrated thermal solution. The rest of this section is devoted to defining the MXM-I, II, and III mechanical restrictions in greater detail. The definitions provided are divided up into “zones” on the MXM that define z-height restrictions, and “surface keep outs”. Written definitions are followed by detailed mechanical drawings of each MXM with its associated restricted areas.
SP-01106-001_v1.0
12 05/14/04
MXM Electromechanical Specification
Z-Height Restrictions Topside
SP-01106-001_v1.0
Zone A: Maximum Z Height on Topside of PCB. The maximum height from the surface of the MXM PCB that any surface mounted component, or other attribute of the MXM may extend above the PCB surface. The thermal solution is not restricted by this blanket height restriction. Zone C: GPU Spreader Plate. A thermal spreader plate is required to assist in cooling the GPU. This restriction defines the maximum topside component height under this spreader plate. Zone D: Memory Area Opposite the Edge Connector. A restriction is defined on all three MXM graphics modules under memory spreader plates. The memory spreader plates are broken into two separate keep out regions because of unique geometric requirements for each. The “D” zone is associated with the memory located directly opposite the PCB’s edge connector. On the highest power consuming modules, the zone D memory spreader plate will be an integral part of the GPU spreader. On the lowest power MXM-I and II modules, the memory spreaders could be made design options or removable. ¾ Zone D-I Defines the z-height restriction in the D-zone for MXM-I. This zone is designed to accommodate power supply components for configurations with two memories on the MXM PCB. ¾ Zone D-II Defines the z-height restriction in the D-zone for MXM-II and is equivalent to Zone D-I in order to maintain thermal solution compatibility between MXM-I and MXM-II. ¾ Zone D-III Defines the z-height restriction in the D-zone for MXM-III and is not required to be compatible with the thermal solution for MXM-I or MXM-II, and has unique requirements. Zone E: Memory Area on Topside to Right of the Edge Connector Defines the z-height restriction for all components except for memories. This area is along the right-hand edge of the MCM PCB as viewed from the topside of the MXM with the connector edge at the bottom position. Zone F: Topside System Integration. There are two holes in each MXM graphics module set aside for mechanically attaching the MXM to a notebook computer system. A cylindrically shaped zero height keep out region has been defined on the topside of the MXM in order to allow for an attachment feature from the notebook system to extend onto the MXM and in combination with a fastener to hold the MXM securely in place.
13 05/14/04
MXM Electromechanical Specification
Zone G: Topside Heat Pipe Exit Routing If a heat pipe(s) is (are) used as a portion of the cooling solution or some other similar means is used to transfer heat from the GPU spreader plate to a remote heat exchanger, this height restriction defines the maximum component height restriction in the three locations where the heat pipe may transition off of the PCB. The zones are oriented with the edge connector down in the “6 o-clock” position. ¾ Zone G1 Defines the maximum height of any board component in the area of the MXM and the restriction extends to the left/”9-oclock” of the GPU beyond the GPU spreader plate. ¾ Zone G2 Defines the maximum height of any board component in the area of the MXM and the restriction extends to the “top/12 o-clock” of the GPU beyond the memory or GPU spreader plate. ¾ Zone G3 Defines the maximum height of any board component in the area of the MXM and the restriction extends to the “right/3 o-clock” of the GPU beyond the memory or GPU spreader plate.
Backside Zone B: Maximum Z-Height on Backside of the MXM PCB The maximum height from the surface of the MXM PCB that any surface mounted component and/or other attribute of the MXM may extend below the MXM surface with the exception of back side memory and that memory's associated thermal solution. Zone B defines the general z-height restriction. For the MXM-III only, the backing plate may exceed the 1.2 mm height restriction. Zone H: Backside Memory Near the Edge Connector Z-height restriction under the thermal spreader centered on the memory on the backside of the PCB opposite the edge connector. Zone J: Backside Memory Opposite the Edge Connector Z-height restriction under the thermal spreader centered on the memory on the backside of the PCB not opposite of the edge connector.
SP-01106-001_v1.0
14 05/14/04
MXM Electromechanical Specification
Surface Keep Outs Topside Surface Keep Out 1: Thermal Solution Attach. Surface keep outs are defined surrounding the thermal integration through holes in the PCB in order to accommodate varied thermal solution designs and grounding of the thermal solutions to reduce EMI. Surface Keep Out 2: System Integration - Top. Holes in the MXM PCB have been defined for mechanical integration of the MXM into a notebook system. There are topside surface keep outs defined surrounding these system integration through holes. Surface Keep Out 3: Edge Connector. This is space reserved on the topside of the MXM for appropriate edge connector design and integration.
Backside Surface Keep Out 4: System Integration - Bottom. Holes in the MXM PCB have been defined for mechanical integration of the MXM into a notebook system. There are bottomside surface keep outs defined surrounding these system integration through holes Surface Keep Out 5: Edge Connector. This is space reserved on the bottomside of the MXM for appropriate edge connector design and integration.
Table 3 defines the height restrictions and surface keep outs on the top and back of MXM-I, MXM-II and MXM-III.
Table 3.
Height Restrictions
MXM Z-Height Restriction Keep Out Zones Topside (mm) 3.5
B
1.2
C
1.84
H
0.66
D-I, D-II
2.00
J
0.66
D-III, E
0.66
G
2.64
Note:
SP-01106-001_v1.0
Bottomside (mm)
A,F
There is a 0.25 mm air gap maintained between the maximum allowed zheight from the backside of the MXM and the maximum z-height allowed on the topside of the motherboard directly under the MXM.
15 05/14/04
MXM Electromechanical Specification
Mechanical Keep Out Drawings The mechanical drawings shown in this section explicitly define the z-height restricted zones and surface keep outs. Figure 8 shows the general z-height restrictions for all MXM graphics modules.
Figure 8.
SP-01106-001_v1.0
MXM Side View, Top and Backside Height Restrictions for MXM Modules
16 05/14/04
MXM Electromechanical Specification
MXM Module Keep Outs Figure 9 through Figure 14 define the top and bottom surface keep outs for MXMI, MXM-II and MXM-III.
Figure 9.
SP-01106-001_v1.0
MXM-I Top Surface Keep Outs
17 05/14/04
MXM Electromechanical Specification
Figure 10.
SP-01106-001_v1.0
MXM-I Bottom Surface Keep Outs
18 05/14/04
MXM Electromechanical Specification
Figure 11.
SP-01106-001_v1.0
MXM-II Top Surface Keep Outs
19 05/14/04
MXM Electromechanical Specification
Figure 12.
SP-01106-001_v1.0
MXM-II Bottom Surface Keep Outs
20 05/14/04
MXM Electromechanical Specification
Figure 13.
SP-01106-001_v1.0
MXM-III Top Surface Keep Outs
21 05/14/04
MXM Electromechanical Specification
Figure 14.
SP-01106-001_v1.0
MXM-III Bottom Surface Keep Outs
22 05/14/04
MXM Electromechanical Specification
Figure 15 through Figure 21 show the mechanical drawings of the top and back of the MXM-I, MXM-II, MXM-III and define the z-height restriction zones. In cases where z-height restriction zones overlap, the most restrictive of the overlapping zones will always take precedence.
Figure 15.
SP-01106-001_v1.0
MXM-I Z-Height Restriction Zones
23 05/14/04
MXM Electromechanical Specification
Figure 16.
SP-01106-001_v1.0
MXM-II Topside Z-Height Restriction Zones
24 05/14/04
MXM Electromechanical Specification
Figure 17.
SP-01106-001_v1.0
MXM-II Bottomside Z-Height Restriction Zones
25 05/14/04
MXM Electromechanical Specification
Figure 18.
SP-01106-001_v1.0
MXM-III Topside Z-Height Restriction Zones
26 05/14/04
MXM Electromechanical Specification
Figure 19.
SP-01106-001_v1.0
MXM-III Topside Z-Height Restriction Zones (Continued)
27 05/14/04
MXM Electromechanical Specification
Figure 20.
SP-01106-001_v1.0
MXM-III Topside Z-Height Restriction Zones (Continued)
28 05/14/04
MXM Electromechanical Specification
Figure 21.
SP-01106-001_v1.0
MXM-III Bottomside Z-Height Restriction Zones
29 05/14/04
MXM Electromechanical Specification
Mechanical Requirements Backing Plate Each MXM graphics module requires a mechanical backing plate design that shall be implemented as needed to compensate for a warped board resulting from thermal solution loading requirements. For MXM-I and MXM-II the backing plate is contained within the 1.2 mm universal z-height restriction. For MXM-III only, the backing plate is allowed to exceed the 1.2 mm height restriction. This backing plate can be unique for each MXM design. In MXM configurations that have memory on the backside of the PCB, the memory and the portion of the cooling solution covering the memory may exceed the Zone-C height restriction.
Thermal Solution Mounting The thermal solution is mounted to the MXM with M2.5 screws from the bottomside of the PCB. A specific screw size is defined to ensure inter-board compatibility because the backing plates may be unique to each MXM.
SP-01106-001_v1.0
30 05/14/04
Electrical Specifications
PCI Express Support The Mobile PCI Express Module (MXM) supports a link of up to sixteen bidirectional PCI Express differential signaling lanes. It is compliant with PCI Express Base Specification 1.0a except for power delivery and power management. Notebook power requirements supercede PCI Express power specifications. The MXM does not support Hot-Plug insertion.
Electrical Connector The Mobile PCI Express Module (MXM) utilizes a 230 circuit card-edge connection system. The contacts are rated for 0.5 A steady state current. The connector accommodates card thicknesses of 1.2 mm and will initially have three different connector height options. The connector heights are 5 mm, 2.7 mm and 1.5 mm surface to surface spacing between the MXM and the motherboard. Different connector heights can be developed in the future. All external and internal notebook interfaces are routed through the MXM’s connector and down to the motherboard. The motherboard will then connect these signals from the MXM to the appropriate circuitry. Figure 22 through Figure 24 describe the MXM connector. Table 4 lists the connector pinout.
SP-01106-001_v1.0
31 05/14/04
MXM Electromechanical Specification
Figure 22.
SP-01106-001_v1.0
MXM Connector Motherboard Footprint
32 05/14/04
MXM Electromechanical Specification
Figure 23.
SP-01106-001_v1.0
MXM Connector Top Down and Side View
33 05/14/04
MXM Electromechanical Specification
Card Edge Finger Pattern, Topside
Card Edge Finger Pattern, Bottomside
MXM Card Edge Finger Pattern, Side View
Figure 24. SP-01106-001_v1.0
MXM Card Edge Finger Pattern 34 05/14/04
MXM Electromechanical Specification
Table 4.
Connector Pinout
Pin# Signal Name
Pin#
Signal Name
Pin# Signal Name
Pin#
Signal Name
1
PWR_SRC
2
1V8RUN
87
PEX_RX7
88
PEX_TX7#
3
PWR_SRC
4
1V8RUN
89
GND
90
PEX_TX7
5
PWR_SRC
6
1V8RUN
91
PEX_RX6#
92
GND
7
PWR_SRC
8
1V8RUN
93
PEX_RX6
94
PEX_TX6#
9
PWR_SRC
10
1V8RUN
95
GND
96
PEX_TX6
11
PWR_SRC
12
1V8RUN
97
PEX_RX5#
98
GND
13
PWR_SRC
14
1V8RUN
99
PEX_RX5
100
PEX_TX5#
15
PWR_SRC
16
RUNPWROK
101
GND
102
PEX_TX5
17
GND
18
5VRUN
103
PEX_RX4#
104
GND
19
GND
20
GND
105
PEX_RX4
106
PEX_TX4#
21
GND
22
GND
107
GND
108
PEX_TX4
23
GND
24
GND
109
PEX_RX3#
110
GND
25
KEY
26
KEY
111
PEX_RX3
112
PEX_TX3#
27
KEY
28
KEY
113
GND
114
PEX_TX3
29
KEY
30
KEY
115
PEX_RX2#
116
GND
31
KEY
32
KEY
117
PEX_RX2
118
PEX_TX2#
33
KEY
34
KEY
119
GND
120
PEX_TX2
35
KEY
36
KEY
121
PEX_RX1#
122
GND
37
PEX_RX15#
38
PRSNT2#
123
PEX_RX1
124
PEX_TX1#
39
PEX_RX15
40
PEX_TX15#
125
GND
126
PEX_TX1
41
GND
42
PEX_TX15
127
PEX_RX0#
128
GND
43
PEX_RX14#
44
GND
129
PEX_RX0
130
PEX_TX0#
45
PEX_RX14
46
PEX_TX14#
131
GND
132
PEX_TX0
47
GND
48
PEX_TX14
133
PEX_REFCLK#
134
PRSNT1#
49
PEX_RX13#
50
GND
135
PEX_REFCLK
136
TV_C/HDTV_Pr
51
PEX_RX13
52
PEX_TX13#
137
CLK_REQ#
138
GND
53
GND
54
PEX_TX13
139
PEX_RST#
140
TV_Y/HDTV_Y
55
PEX_RX12#
56
GND
141
RSVD
142
GND
57
PEX_RX12
58
PEX_TX12#
143
RSVD
144
TV_CVBS/HDTV_Pb
59
GND
60
PEX_TX12
145
SMB_DAT
146
GND
61
PEX_RX11#
62
GND
147
SMB_CLK
148
VGA_RED
63
PEX_RX11
64
PEX_TX11#
149
THERM#
150
GND
65
GND
66
PEX_TX11
151
VGA_HSYNC
152
VGA_GRN
67
PEX_RX10#
68
GND
153
VGA_VSYNC
154
GND
69
PEX_RX10
70
PEX_TX10#
155
DDCA_CLK
156
VGA_BLU
71
GND
72
PEX_TX10
157
DDCA_DAT
158
GND
73
PEX_RX9#
74
GND
159
IGP_UCLK#
160
LVDS_UCLK#
75
PEX_RX9
76
PEX_TX9#
161
IGP_UCLK
162
LVDS_UCLK
77
GND
78
PEX_TX9
163
GND
164
GND
79
PEX_RX8#
80
GND
165
RSVD
166
LVDS_UTX3#
81
PEX_RX8
82
PEX_TX8#
167
RSVD
168
LVDS_UTX3
83
GND
84
PEX_TX8
169
RSVD
170
GND
85
PEX_RX7#
86
GND
171
IGP_UTX2#
172
LVDS_UTX2#
SP-01106-001_v1.0
35 05/14/04
MXM Electromechanical Specification
Pin# Signal Name
Pin#
Signal Name
Pin# Signal Name
Pin#
Signal Name
173
IGP_UTX2
174
LVDS_UTX2
207
208
LVDS_LTX1#
175
GND
176
GND
IGP_LTX1# / DVI_B_TX1#
177
IGP_UTX1#
178
LVDS_UTX1#
209
IGP_LTX1 / DVI_B_TX1
210
LVDS_LTX1
179
IGP_UTX1
180
LVDS_UTX1
211
GND
212
GND
181
GND
182
GND
213
214
LVDS_LTX0#
183
IGP_UTX0#
184
LVDS_UTX0#
IGP_LTX0# / DVI_B_TX0#
185
IGP_UTX0
186
LVDS_UTX0
215
LVDS_LTX0
GND
188
GND
IGP_LTX0 / DVI_B_TX0
216
187 189
IGP_LCLK# / DVI_B_CLK#
190
LVDS_LCLK#
217
DVI_A_HPD
218
GND
219
DVI_A_CLK#
220
DDCC_DAT
191
IGP_LCLK / DVI_B_CLK
192
LVDS_LCLK
221
DVI_A_CLK
222
DDCC_CLK
223
GND
224
LVDS_PPEN
DVI_B_HPD / GND
194
225
DVI_A_TX2#
226
LVDS_BL_BRGHT
195
RSVD
196
LVDS_LTX3#
227
DVI_A_TX2
228
LVDS_BLEN
197
RSVD
198
LVDS_LTX3
229
GND
230
DDCB_DAT
199
GND
200
GND
231
DVI_A_TX1#
232
DDCB_CLK
201
IGP_LTX2# / DVI_B_TX2#
202
LVDS_LTX2#
233
DVI_A_TX1
234
2V5RUN
235
GND
236
GND
203
IGP_LTX2 / DVI_B_TX2
204
LVDS_LTX2
237
DVI_A_TX0#
238
3V3RUN
GND
206
239
DVI_A_TX0
240
3V3RUN
241
GND
242
3V3RUN
193
205
SP-01106-001_v1.0
GND
GND
36 05/14/04
MXM Electromechanical Specification
Connector Pin Descriptions Table 5 contains pin descriptions for each signal type. All Input/Output classifications are relative to the MXM graphics module.
Table 5.
Connector Pin Descriptions
Signal Name
Input/Output
Description
DVI_A_TX0-2, DVI_A_TX0-2#
Output, 100 Ohm Diff
TMDS output for either single link DVI or dual link DVI
DVI_A_CLK, DVI_A_CLK#
Output, 100 Ohm Diff
TMDS clock for either single link DVI or dual link DVI
DVI_A_HPD
Input
DVI hot plug detect for DVI_A
DVI_B_TX0-2, DVI_B_TX0-2#
Output, 100 Ohm Diff
TMDS output for either single link DVI or dual link DVI, upper bits for dual-link. Note: these pins are shared with IGP LVDS loop through pins
DVI_B_CLK, DVI_B_CLK#
Output, 100 Ohm Diff
TMDS clock, only used for second single-link DVI. Note: these pins are shared with IGP LVDS loop through pins
DVI_B_HPD
Input/GND
DVI hot plug detect for DVI_B. Tie to GND on motherboard if notebook is configured for IGP LVDS pass through
DDCA_CLK
Output, 3.3 V logic levels 2.2K Pull-up required on MXM graphics module
Serial link, can connect to VGA, DVI_A or DVI_B. Configuration needs to be stored in MXM system information.
DDCA_DAT
BI-Directional 3.3 V logic levels 2.2K Pull-up required on MXM graphics module,
Serial link, can connect to VGA, DVI_A or DVI_B. Configuration needs to be stored in MXM system information.
DDCB_CLK
Output, 3.3 V logic levels 2.2K Pull-up required on MXM graphics module
Serial link, can connect to VGA, DVI_A or DVI_B. Configuration needs to be stored in MXM system information.
DDCB_DAT
BI-Directional 3.3 V logic levels 2.2K Pull-up required on MXM graphics module
Serial link, can connect to VGA, DVI_A or DVI_B. Configuration needs to be stored in MXM system information.
LVDS_PPEN
Output, 3.3 V logic levels
LVDS Panel Power enable
LVDS_BLEN
Output, 3.3 V logic levels
LVDS Panel backlight enable
LVDS_BL_BRGHT
PWM Output, 3.3 V logic levels
LVSD Panel brightness control, duty cycle determines output level
LVDS_UTX0-3, LVDS_UTX0-3#
Output, 100 Ohm Diff
LVDS output for dual link
IGP_UTX0-2, IGP_UTX0-2#
Input, 100 Ohm Diff
LVDS input that loops back to LVDS_UTX02, LVDS_UTX0-2# to provide path for LVDS with IGP only.
LVDS_UCLK, LVDS_UCLK#
Output, 100 Ohm Diff
LVDS clock for dual link
SP-01106-001_v1.0
37 05/14/04
MXM Electromechanical Specification
Signal Name
Input/Output
Description
IGP_UCLK, IGP_UCLK#
Input, 100 Ohm Diff
LVDS input that loops back to LVDS_UCLK, LVDS_UCLK# to provide path for LVDS with IGP only.
LVDS_LTX0-3, LVDS_LTX0-3#
Output, 100 Ohm Diff
LVDS output for either single link or dual link
IGP_LTX0-2, IGP_LTX0-2#
Input, 100 Ohm Diff
LVDS input that loops back to LVDS_LTX02, LVDS_LTX0-2# to provide path for LVDS with IGP only. Note: these pins are shared with DVI_B pins
LVDS_LCLK, LVDS_LCLK#
Output, 100 Ohm Diff
LVDS clock for either single link or dual link
IGP_LCLK, IGP_LCLK#
Input, 100 Ohm Diff
LVDS input that loops back to LVDS_LCLK, LVDS_LCLK# to provide path for LVDS with IGP only. Note: these pins are shared with DVI_B pins
TV_Y/HDTV_Y
Output, 37.5 Ohm +/- 2 Ohms
TV_OUT Luma/HDTV_OUT Luma
TV_C/HDTV_Pr
Output, 37.5 Ohm +/- 2 Ohms
TV_OUT Chroma/HDTV_OUT
TV_CVBS/HDTV_Pb
Output, 37.5 Ohm +/- 2 Ohms
TV_OUT Composite/HDTV_OUT Chroma Blue
DDCC_CLK
Output, 3.3 V logic levels 2.2K pull-up required on motherboard
Serial link, connect to EDID LVDS Panel and to MXM System Information ROM. This link is not to be used for external interfaces
DDCC_DAT
BI-Directional 2.2K pull-up required on motherboard
Serial link, connect to EDID LVDS Panel and to MXM System Information Rom. This link is not to be used for external interfaces
VGA_BLU
Output, 37.5 Ohm +/- 2 Ohms
VGA Blue Output
VGA_RED
Output, 37.5 Ohm +/- 2 Ohms
VGA Red Output
VGA_GRN
Output, 37.5 Ohm +/- 2 Ohms
VGA Green Output
VGA_HSYNC
Output, 3.3 V logic levels
VGA Horizontal Sync
VGA_VSYNC
Output, 3.3 V logic levels
VGA Vertical Sync
SMB_CLK
Input, 5 V tolerant
Serial link for thermal sensor on GPU. Connect to motherboard's SMBus Clock signal.
SMB_DAT
Bi-Dir, 5 V tolerant
Serial link for thermal sensor on GPU. Connect to motherboard's SMBus Data signal.
THERM#
Open Collector Output, active low, 5 V tolerant
Indicates a thermal alert. Connect to motherboard's SMBus Alert signal.
PRSNT1#
GND
Card present detect, indicates if MXM graphics module is present. Tie to pull-up on motherboard. If high then MXM is not present. If low then MXM is present. Can be used to control IGP upgrade multiplexers
PRSNT2#
GND
Tied to Ground on both motherboard and MXM. Reserved for future functionality.
SP-01106-001_v1.0
Chroma Red
38 05/14/04
MXM Electromechanical Specification
Signal Name
Input/Output
Description
CLK_REQ#
Output, active low
Indicates need for PEX_REFCLK
PEX_RST#
Input, active low
PCI_Express reset
PEX_REFCLK, PEX_REFCLK#
Input, 100 Ohm Diff
PCI Express reference clock.
PEX_TX0-15, PEX_TX0-15#
Input, 100 Ohm Diff
PCI Express 16 lanes, output from northbridge. DC blocking capacitiors need to be placed on the motherboard.
PEX_RX0-15, PEX_RX0-15#
Output, 100 Ohm Diff
PCI Express 16 lanes, input to northbridge. DC blocking capacitors need to be placed on the MXM graphics module.
RUNPWROK
Input
Indicates that all power to the MXM is within the specified tolerances
3V3RUN
Power input
3.3 V run power
5VRUN
Power input
5 V run power
2V5RUN
Power input
2.5 V run power
1V8RUN
Power input
1.8 V run power
PWR_SRC
Power input
Battery power
Power Requirements The Mobile PCI Express Module (MXM) requires the following power to be provided by the notebook (Table 6).
Table 6.
Power Requirements
Voltage Rail 3V3RUN
Voltage
Current
Power
Notes
3.3 V +/- 5%
1.5 Amps
4.95 W
3.3 V run
5VRUN
5 V +/- 5%
0.5 Amps
2.5 W
5 V run
2V5RUN
2.5 V +/- 5%
0.5 Amps
1.25 W
2.5 V run
1V8RUN
1.8 V +/- 5%
3.5 Amps
6.3 W
1.8 V run
PWR_SRC
7.5 V* to 22 V
Up to 4 Amps
8.9 W to 38.9 W
Battery, store power capability in MXM system information.
* For a platform MXM input budget greater than 30 W, the minimum PWR_SRC voltage is input budget/4A. For example, an input budget of 35 W, the PWR_SRC Vmin = 8.75 V
SP-01106-001_v1.0
39 05/14/04
MXM Electromechanical Specification
Power Throttling The MXM will automatically detect power supply limitations and thermal limitations of the notebook platform and will automatically throttle its clocks to stay within the power and thermal limits. If the notebook platform’s power supply and MXM thermal cooler are equal too or exceeds the MXM’s power requirements, the MXM will run at full speed. The MXM system information data contains the necessary information for MXM throttling. This data is stored in either the SBIOS or the MXM system information ROM on the Notebook’s motherboard.
System Requirements Display Requirements Panel Type The MXM system only supports EDID Panels.
LVDS Panel Power The motherboard shall provide power to the notebook’s LVDS panel. The power is optionally controlled by LVDS_PPEN.
VGA, TV_Out Impedance The motherboard shall route all RGB signals and TV_OUT signals with 37.5 Ohms impedance. A 75 Ohm termination resistor shall be placed at the end of the trace as close as possible to the output filters which should be as close as possible to the output connectors. For notebooks configured to support TV_Out, 75 Ohm termination resistors are required on any unused TV_Out signals. The MXM graphics module shall route all RGB signals and TV_OUT signals with 37.5 Ohms.
Output Filters The motherboard is required to have output filters on all VGA output lines and on all TV output lines. These filters should be placed as close as possible to the external connectors.
SP-01106-001_v1.0
40 05/14/04
MXM Electromechanical Specification
Other Requirements MXM System Information ROM The motherboard is required to store the MXM System Information in either the SBIOS or in the MXM System Information ROM. The implementation is a design decision left to the system provider’s discretion. Information regarding the data stored in the MXM System Information is found in the MXM Software Specification. For MXM System Information ROM implementations, the Motherboard is required to place a 256 Byte serial ROM that connects to DDCC_CLK and DDCC_DAT with a device address of 0xAC. The ROM must be compatible to an Atmel 24C02 and operate with 3.3 V signaling
5 V Tolerance The motherboard shall provide back drive isolation and level shifting for all DDC lines, VGA_HSYNC and VGA_VSYNC. The MXM graphics modules do not drive output signals at 5 V output levels and its inputs are not 5 V tolerant unless specifically stated.
DVI_B/IGP_LVDS Pin Sharing The MXM must not power up DVI_B interfaces until it has verified that the notebook is configured for DVI_B. This information will be stored in the MXM system information ROM. IGP LVDS pass through and DVI_B can not co-exist in the same notebook, they are mutually exclusive. When configured for IGP LVDS pass through, DVI_B_HPD must be tied to GND on the motherboard.
DVI Detection Circuitry The motherboard is required to have input filters on both DVI_HPD lines. The MXM graphics module is required to provide level shifting and clamping for these signals.
MXM Cooling Fan If it is necessary for the MXM graphics module to have its own dedicated fan in the notebook’s chassis, the motherboard is required to provide power and speed control for the fan.
MXM Grounding The MXM graphics module is grounded through the MXM connector and the two mounting holes. The thermal solution will be grounded through the thermal mounting holes and the landing area around the holes.
SP-01106-001_v1.0
41 05/14/04
MXM Electromechanical Specification
Power Up Sequencing There is no requirement for power up sequencing on the motherboard to support MXM graphics modules. If power up sequencing is required, each MXM graphics module is responsible for its own power up sequencing.
Additional Function Support In order to facilitate additional functions implemented with GPIOs not supported in this specification, such as Japan-D connector or multiplexing TV out to separate connectors for Component out and S-Video, the motherboard is required to place a serial link GPIO Expander that connects to DDCC_CLK and DDCC_DAT with a device address of 0x4C. This address allows the motherboard designer to utilize GPIO and ROM combination devices to reduce overall implementation costs. The specific function of each GPIO shall be stored in the MXM System Information Structure. The MXM System Information Structure is found in the MXM Software Specification.
SP-01106-001_v1.0
42 05/14/04
Appendix: Support Information
Configuring Notebook for MXM with IGP Configurable Option Use of the MXM platform will allow maximum flexibility in configuring different graphics capabilities all with the same motherboard. Through the use of zero Ohm stuffing resistors the manufacturer can easily decide if the notebook will be configured with an IGP or a MXM graphics module all with the same motherboard platform. Refer to Figure 25 for the notebook output topology with IGP.
SP-01106-001_v1.0
43 05/14/04
MXM Electromechanical Specification
Figure 25.
Notebook Output Topology with IGP
Upgradeable Option To facilitate possible upgrades to the notebook a LVDS pass through feature was added to the MXM system. This pass through capability was needed since active devices that work at LVDS data rates are very expensive. To support LVDS pass through, the IGP’s LVDS output signals will need to be routed over to the MXM connector and connect to the IGP_LVDS signals. An extremely low cost passive PCB will be inserted into the MXM connector that will complete the circuit path between the IGP’s output signals and the LVDS panel input signals. VGA and TV_out signals are switched by an active device between the IGP and MXM. When a MXM is installed at a later date the Mux will switch over to the MXM output signals and the MB_LVDS signals will be interrupted by the MXM card. If PRSNT#1 is low then the MUX will connect the VGA and TV circuit paths to the MXM. If DVI is supported on an IGP platform, the TMDS transmitter will reside on the LVDS pass through card and drive TMDS outputs on DVI_A signals. The IGP would need to multiplex TMDS data over PCI Express lines. See Figure 26
Figure 26.
SP-01106-001_v1.0
Notebook Output Topology with IGP
44 05/14/04
Notice ALL NVIDIA DESIGN SPECIFICATIONS, REFERENCE BOARDS, FILES, DRAWINGS, DIAGNOSTICS, LISTS AND OTHER DOCUMENTS (TOGETHER AND SEPARATELY, "MATERIALS") ARE BEING PROVIDED "AS IS." NVIDIA MAKES NO WARRANTIES, EXPRESSED, IMPLIED, STATUTORY OR OTHERWISE WITH RESPECT TO THE MATERIALS, AND EXPRESSLY DISCLAIMS ALL IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE.
Information furnished is believed to be accurate and reliable. However, NVIDIA Corporation assumes no responsibility for the consequences of use of such information or for any infringement of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of NVIDIA Corporation. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. NVIDIA Corporation products are not authorized for use as critical components in life support devices or systems without express written approval of NVIDIA Corporation. Trademarks NVIDIA, the NVIDIA logo and MXM Graphics Module, are trademarks of NVIDIA Corporation in the United States and other countries. Other company and product names may be trademarks of the respective companies with which they are associated. Copyright © 2004 by NVIDIA Corporation. All rights reserved
NVIDIA Corporation 2701 San Tomas Expressway Santa Clara, CA 95050 www.nvidia.com
SP-01106-001_v1.0 May 2004
Document Change History
Version
Date
1.0
05/14/04
SP-01106-001_v1.0
Reason for Change Initial Release
i 05/14/04
Table of Contents Document Change History.............................................................................................. i Overview .......................................................................................................................1 Key Features ..................................................................................................................... 1 Configurations ................................................................................................................... 2 Display Options ................................................................................................................. 2 MXM Display options...................................................................................................... 3 IGP and MXM .................................................................................................................... 3 Mechanical Specifications .............................................................................................4 Mechanical Description....................................................................................................... 4 Mounting and Retention ....................................................................................................12 MXM Compatibility ............................................................................................................12 Mechanical .......................................................................................................................12 Keep Out Definitions .........................................................................................................12 Z-Height Restrictions ....................................................................................................13 Surface Keep Outs........................................................................................................15 Mechanical Keep Out Drawings..........................................................................................16 MXM Module Keep Outs ................................................................................................17 Mechanical Requirements..................................................................................................30 Backing Plate ...............................................................................................................30 Thermal Solution Mounting ...........................................................................................30 Electrical Specifications...............................................................................................31 PCI Express Support .........................................................................................................31 Electrical Connector ..........................................................................................................31 Connector Pin Descriptions................................................................................................37 Power Requirements.........................................................................................................39 Power Throttling...............................................................................................................40 System Requirements .......................................................................................................40 Display Requirements ...................................................................................................40 Other Requirements .....................................................................................................41 Additional Function Support...............................................................................................42
SP-01106-001_v1.0
ii 05/14/04
Appendix: Support Information ..................................................................................43 Configuring Notebook for MXM with IGP ............................................................................43 Configurable Option......................................................................................................43 Upgradeable Option......................................................................................................44
SP-01106-001_v1.0
iii 05/14/04
List of Figures Figure 1.
Display Options ................................................................................................. 3
Figure 2.
MXM Form Factor .............................................................................................. 5
Figure 3.
MXM-I Topside.................................................................................................. 6
Figure 4.
MXM-II Topside................................................................................................. 7
Figure 5.
MXM-II Backside ............................................................................................... 8
Figure 6.
MXM-III Topside ..............................................................................................10
Figure 7.
MXM-III Backside .............................................................................................11
Figure 8.
MXM Side View, Top and Backside Height Restrictions for MXM Modules..............16
Figure 9.
MXM-I Top Surface Keep Outs ..........................................................................17
Figure 10.
MXM-I Bottom Surface Keep Outs .....................................................................18
Figure 11.
MXM-II Top Surface Keep Outs .........................................................................19
Figure 12.
MXM-II Bottom Surface Keep Outs ....................................................................20
Figure 13.
MXM-III Top Surface Keep Outs ........................................................................21
Figure 14.
MXM-III Bottom Surface Keep Outs ...................................................................22
Figure 15.
MXM-I Z-Height Restriction Zones .....................................................................23
Figure 16.
MXM-II Topside Z-Height Restriction Zones........................................................24
Figure 17.
MXM-II Bottomside Z-Height Restriction Zones...................................................25
Figure 18.
MXM-III Topside Z-Height Restriction Zones ......................................................26
Figure 19.
MXM-III Topside Z-Height Restriction Zones (Continued)....................................27
Figure 20.
MXM-III Topside Z-Height Restriction Zones (Continued)....................................28
Figure 21.
MXM-III Bottomside Z-Height Restriction Zones .................................................29
Figure 22.
MXM Connector Motherboard Footprint..............................................................32
Figure 23.
MXM Connector Top Down and Side View ..........................................................33
Figure 24.
MXM Card Edge Finger Pattern..........................................................................34
Figure 25.
Notebook Output Topology with IGP .................................................................44
Figure 26.
Notebook Output Topology with IGP .................................................................44
SP-01106-001_v1.0
iv 05/14/04
List of Tables Table 1.
Board Configurations ......................................................................................... 2
Table 2.
MXM Display Options ......................................................................................... 2
Table 3.
Height Restrictions ...........................................................................................15
Table 4.
Connector Pinout..............................................................................................35
Table 5.
Connector Pin Descriptions ...............................................................................37
Table 6.
Power Requirements ........................................................................................39
SP-01106-001_v1.0
v 05/14/04
Overview
The Mobile PCI Express Module (MXM) is a consistent graphics interface for PCI Express notebooks. The specification describes the electromechanical interfaces including feature set, dimensions, connector pinouts and electrical interfaces for each MXM Graphics Module™. The MXM graphics modules consist of a standard single 230-pin edge connector in which all Input/Outputs are routed through.
Key Features
SP-01106-001_v1.0
Low cost Small size Scalable performance 16 lane PCI Express support LVDS panel support Dual DVI support VGA support Video out support Upgradeable graphics
1 05/14/04
MXM Electromechanical Specification
Configurations Table 1 lists the dimensions and maximum power for the three MXM graphics module types.
Table 1.
Board Configurations
MXM Type
Width
Length
Power
MXM-I
70 mm
68 mm
Up to 18 W
MXM-II
73 mm
78 mm
Up to 25 W
MXM-III
82 mm
100 mm
Up to 35 W
Display Options Table 2 lists the MXM graphics boards display options.
Table 2.
MXM Display Options
Display Options
SP-01106-001_v1.0
MXM Display Solutions
VGA
Routed to either VGA or DVI-I connectors on motherboard
Two single-link DVI or one dual-link DVI
DVI routed to connector on motherboard and/or through docking station
Video out
Video out routed to connector on motherboard, Supports Composite, S-Video and HDTV
Single dual-link LVDS
LVDS routed to connector on the motherboard.
2 05/14/04
MXM Electromechanical Specification
MXM Display options MXM is capable of supporting the following interfaces: One dual-link LVDS panel display One TV output One VGA output One dual-link TMDS or two single-link TMDS outputs to DVI
All interfaces are routed through the MXM’s connector to the motherboard (Figure 1). TVOut
VGA DVI (2 Single or 1 dual Link)
MXM L V D S
Figure 1.
Display Options
IGP and MXM The MXM platform has been designed to co-exist with Integrated Graphics Processors (IGP). An IGP notebook designed to support MXM graphics modules can be populated with or without a MXM graphics card. If no MXM graphics module is present, installation of a loop through card is required to complete circuit paths for LVDS signals and enable panel operation.
SP-01106-001_v1.0
3 05/14/04
Mechanical Specifications
Mechanical Description The MXM-I and MXM-II form factors (Figure 2 through Figure 5) accommodate GPUs up to 35 mm × 35 mm in size. The four holes surrounding the GPU are used to mount the thermal solution. The two holes on the far end of the board are for stand-offs to mount to the notebook.
SP-01106-001_v1.0
4 05/14/04
MXM Electromechanical Specification
Figure 2.
SP-01106-001_v1.0
MXM Form Factor
5 05/14/04
MXM Electromechanical Specification
Figure 3.
SP-01106-001_v1.0
MXM-I Topside
6 05/14/04
MXM Electromechanical Specification
Figure 4.
SP-01106-001_v1.0
MXM-II Topside
7 05/14/04
MXM Electromechanical Specification
Figure 5.
SP-01106-001_v1.0
MXM-II Backside
8 05/14/04
MXM Electromechanical Specification
The MXM-III form factor (Figure 6 and Figure 7) will accommodate GPUs up to 40 mm × 40 mm in size. The four holes surrounding the GPU are used to mount the thermal solution. The two holes on the far end of the board are for stand-offs to mount to the notebook.
SP-01106-001_v1.0
9 05/14/04
MXM Electromechanical Specification
Figure 6. SP-01106-001_v1.0
MXM-III Topside 10 05/14/04
MXM Electromechanical Specification
Figure 7.
SP-01106-001_v1.0
MXM-III Backside
11 05/14/04
MXM Electromechanical Specification
Mounting and Retention The MXM mounts to the notebook‘s motherboard through a 230-pin right angle edge connector. The connector on the MXM is a card-edge connector consisting of only the PCB with plated contacts. The MXM graphics module is inserted at a 20 to 30 degree angle and then rotated towards the motherboard and then screwed into mechanical mounting stand-offs. The stand-offs will maintain separation from the motherboard and also assist in the retention of the MXM. The stand-off locations will be the same for all MXM graphics modules to allow one motherboard to support the three MXM graphics module types.
MXM Compatibility The MXM has been designed to allow for compatibility between the three MXM graphics module types. The notebook’s mounting holes for the MXM are in the same location for all MXM graphics modules. MXM-I can insert into all notebooks that support MXM graphics modules. MXMII can insert into notebooks that support MXM-II and MXM-III modules. MXMIII modules only insert into notebooks that support a MXM-III module volumetric keep outs. MXM-III thermal solutions are incompatible with MXM-I and MXM-II. MXM-III accommodates a maximum of a 40 mm × 40 mm GPU package where as MXM-I and MXM-II support a maximum of a 35 mm × 35 mm GPU package.
Mechanical Keep Out Definitions Each of the three Mobile PCI Express modules (MXM) has distinct mechanical keep out zones. These keep out zones are a combination of z-height restrictions and surface keep outs on the MXM PCB. The keep outs are necessary for system and thermal solution integration compatibility. These surface keep out volumes are designed to accommodate thermal solutions that dissipate the maximum power a particular MXM graphics module is designed for and to allow mechanical compatibility between modules with an integrated thermal solution. The rest of this section is devoted to defining the MXM-I, II, and III mechanical restrictions in greater detail. The definitions provided are divided up into “zones” on the MXM that define z-height restrictions, and “surface keep outs”. Written definitions are followed by detailed mechanical drawings of each MXM with its associated restricted areas.
SP-01106-001_v1.0
12 05/14/04
MXM Electromechanical Specification
Z-Height Restrictions Topside
SP-01106-001_v1.0
Zone A: Maximum Z Height on Topside of PCB. The maximum height from the surface of the MXM PCB that any surface mounted component, or other attribute of the MXM may extend above the PCB surface. The thermal solution is not restricted by this blanket height restriction. Zone C: GPU Spreader Plate. A thermal spreader plate is required to assist in cooling the GPU. This restriction defines the maximum topside component height under this spreader plate. Zone D: Memory Area Opposite the Edge Connector. A restriction is defined on all three MXM graphics modules under memory spreader plates. The memory spreader plates are broken into two separate keep out regions because of unique geometric requirements for each. The “D” zone is associated with the memory located directly opposite the PCB’s edge connector. On the highest power consuming modules, the zone D memory spreader plate will be an integral part of the GPU spreader. On the lowest power MXM-I and II modules, the memory spreaders could be made design options or removable. ¾ Zone D-I Defines the z-height restriction in the D-zone for MXM-I. This zone is designed to accommodate power supply components for configurations with two memories on the MXM PCB. ¾ Zone D-II Defines the z-height restriction in the D-zone for MXM-II and is equivalent to Zone D-I in order to maintain thermal solution compatibility between MXM-I and MXM-II. ¾ Zone D-III Defines the z-height restriction in the D-zone for MXM-III and is not required to be compatible with the thermal solution for MXM-I or MXM-II, and has unique requirements. Zone E: Memory Area on Topside to Right of the Edge Connector Defines the z-height restriction for all components except for memories. This area is along the right-hand edge of the MCM PCB as viewed from the topside of the MXM with the connector edge at the bottom position. Zone F: Topside System Integration. There are two holes in each MXM graphics module set aside for mechanically attaching the MXM to a notebook computer system. A cylindrically shaped zero height keep out region has been defined on the topside of the MXM in order to allow for an attachment feature from the notebook system to extend onto the MXM and in combination with a fastener to hold the MXM securely in place.
13 05/14/04
MXM Electromechanical Specification
Zone G: Topside Heat Pipe Exit Routing If a heat pipe(s) is (are) used as a portion of the cooling solution or some other similar means is used to transfer heat from the GPU spreader plate to a remote heat exchanger, this height restriction defines the maximum component height restriction in the three locations where the heat pipe may transition off of the PCB. The zones are oriented with the edge connector down in the “6 o-clock” position. ¾ Zone G1 Defines the maximum height of any board component in the area of the MXM and the restriction extends to the left/”9-oclock” of the GPU beyond the GPU spreader plate. ¾ Zone G2 Defines the maximum height of any board component in the area of the MXM and the restriction extends to the “top/12 o-clock” of the GPU beyond the memory or GPU spreader plate. ¾ Zone G3 Defines the maximum height of any board component in the area of the MXM and the restriction extends to the “right/3 o-clock” of the GPU beyond the memory or GPU spreader plate.
Backside Zone B: Maximum Z-Height on Backside of the MXM PCB The maximum height from the surface of the MXM PCB that any surface mounted component and/or other attribute of the MXM may extend below the MXM surface with the exception of back side memory and that memory's associated thermal solution. Zone B defines the general z-height restriction. For the MXM-III only, the backing plate may exceed the 1.2 mm height restriction. Zone H: Backside Memory Near the Edge Connector Z-height restriction under the thermal spreader centered on the memory on the backside of the PCB opposite the edge connector. Zone J: Backside Memory Opposite the Edge Connector Z-height restriction under the thermal spreader centered on the memory on the backside of the PCB not opposite of the edge connector.
SP-01106-001_v1.0
14 05/14/04
MXM Electromechanical Specification
Surface Keep Outs Topside Surface Keep Out 1: Thermal Solution Attach. Surface keep outs are defined surrounding the thermal integration through holes in the PCB in order to accommodate varied thermal solution designs and grounding of the thermal solutions to reduce EMI. Surface Keep Out 2: System Integration - Top. Holes in the MXM PCB have been defined for mechanical integration of the MXM into a notebook system. There are topside surface keep outs defined surrounding these system integration through holes. Surface Keep Out 3: Edge Connector. This is space reserved on the topside of the MXM for appropriate edge connector design and integration.
Backside Surface Keep Out 4: System Integration - Bottom. Holes in the MXM PCB have been defined for mechanical integration of the MXM into a notebook system. There are bottomside surface keep outs defined surrounding these system integration through holes Surface Keep Out 5: Edge Connector. This is space reserved on the bottomside of the MXM for appropriate edge connector design and integration.
Table 3 defines the height restrictions and surface keep outs on the top and back of MXM-I, MXM-II and MXM-III.
Table 3.
Height Restrictions
MXM Z-Height Restriction Keep Out Zones Topside (mm) 3.5
B
1.2
C
1.84
H
0.66
D-I, D-II
2.00
J
0.66
D-III, E
0.66
G
2.64
Note:
SP-01106-001_v1.0
Bottomside (mm)
A,F
There is a 0.25 mm air gap maintained between the maximum allowed zheight from the backside of the MXM and the maximum z-height allowed on the topside of the motherboard directly under the MXM.
15 05/14/04
MXM Electromechanical Specification
Mechanical Keep Out Drawings The mechanical drawings shown in this section explicitly define the z-height restricted zones and surface keep outs. Figure 8 shows the general z-height restrictions for all MXM graphics modules.
Figure 8.
SP-01106-001_v1.0
MXM Side View, Top and Backside Height Restrictions for MXM Modules
16 05/14/04
MXM Electromechanical Specification
MXM Module Keep Outs Figure 9 through Figure 14 define the top and bottom surface keep outs for MXMI, MXM-II and MXM-III.
Figure 9.
SP-01106-001_v1.0
MXM-I Top Surface Keep Outs
17 05/14/04
MXM Electromechanical Specification
Figure 10.
SP-01106-001_v1.0
MXM-I Bottom Surface Keep Outs
18 05/14/04
MXM Electromechanical Specification
Figure 11.
SP-01106-001_v1.0
MXM-II Top Surface Keep Outs
19 05/14/04
MXM Electromechanical Specification
Figure 12.
SP-01106-001_v1.0
MXM-II Bottom Surface Keep Outs
20 05/14/04
MXM Electromechanical Specification
Figure 13.
SP-01106-001_v1.0
MXM-III Top Surface Keep Outs
21 05/14/04
MXM Electromechanical Specification
Figure 14.
SP-01106-001_v1.0
MXM-III Bottom Surface Keep Outs
22 05/14/04
MXM Electromechanical Specification
Figure 15 through Figure 21 show the mechanical drawings of the top and back of the MXM-I, MXM-II, MXM-III and define the z-height restriction zones. In cases where z-height restriction zones overlap, the most restrictive of the overlapping zones will always take precedence.
Figure 15.
SP-01106-001_v1.0
MXM-I Z-Height Restriction Zones
23 05/14/04
MXM Electromechanical Specification
Figure 16.
SP-01106-001_v1.0
MXM-II Topside Z-Height Restriction Zones
24 05/14/04
MXM Electromechanical Specification
Figure 17.
SP-01106-001_v1.0
MXM-II Bottomside Z-Height Restriction Zones
25 05/14/04
MXM Electromechanical Specification
Figure 18.
SP-01106-001_v1.0
MXM-III Topside Z-Height Restriction Zones
26 05/14/04
MXM Electromechanical Specification
Figure 19.
SP-01106-001_v1.0
MXM-III Topside Z-Height Restriction Zones (Continued)
27 05/14/04
MXM Electromechanical Specification
Figure 20.
SP-01106-001_v1.0
MXM-III Topside Z-Height Restriction Zones (Continued)
28 05/14/04
MXM Electromechanical Specification
Figure 21.
SP-01106-001_v1.0
MXM-III Bottomside Z-Height Restriction Zones
29 05/14/04
MXM Electromechanical Specification
Mechanical Requirements Backing Plate Each MXM graphics module requires a mechanical backing plate design that shall be implemented as needed to compensate for a warped board resulting from thermal solution loading requirements. For MXM-I and MXM-II the backing plate is contained within the 1.2 mm universal z-height restriction. For MXM-III only, the backing plate is allowed to exceed the 1.2 mm height restriction. This backing plate can be unique for each MXM design. In MXM configurations that have memory on the backside of the PCB, the memory and the portion of the cooling solution covering the memory may exceed the Zone-C height restriction.
Thermal Solution Mounting The thermal solution is mounted to the MXM with M2.5 screws from the bottomside of the PCB. A specific screw size is defined to ensure inter-board compatibility because the backing plates may be unique to each MXM.
SP-01106-001_v1.0
30 05/14/04
Electrical Specifications
PCI Express Support The Mobile PCI Express Module (MXM) supports a link of up to sixteen bidirectional PCI Express differential signaling lanes. It is compliant with PCI Express Base Specification 1.0a except for power delivery and power management. Notebook power requirements supercede PCI Express power specifications. The MXM does not support Hot-Plug insertion.
Electrical Connector The Mobile PCI Express Module (MXM) utilizes a 230 circuit card-edge connection system. The contacts are rated for 0.5 A steady state current. The connector accommodates card thicknesses of 1.2 mm and will initially have three different connector height options. The connector heights are 5 mm, 2.7 mm and 1.5 mm surface to surface spacing between the MXM and the motherboard. Different connector heights can be developed in the future. All external and internal notebook interfaces are routed through the MXM’s connector and down to the motherboard. The motherboard will then connect these signals from the MXM to the appropriate circuitry. Figure 22 through Figure 24 describe the MXM connector. Table 4 lists the connector pinout.
SP-01106-001_v1.0
31 05/14/04
MXM Electromechanical Specification
Figure 22.
SP-01106-001_v1.0
MXM Connector Motherboard Footprint
32 05/14/04
MXM Electromechanical Specification
Figure 23.
SP-01106-001_v1.0
MXM Connector Top Down and Side View
33 05/14/04
MXM Electromechanical Specification
Card Edge Finger Pattern, Topside
Card Edge Finger Pattern, Bottomside
MXM Card Edge Finger Pattern, Side View
Figure 24. SP-01106-001_v1.0
MXM Card Edge Finger Pattern 34 05/14/04
MXM Electromechanical Specification
Table 4.
Connector Pinout
Pin# Signal Name
Pin#
Signal Name
Pin# Signal Name
Pin#
Signal Name
1
PWR_SRC
2
1V8RUN
87
PEX_RX7
88
PEX_TX7#
3
PWR_SRC
4
1V8RUN
89
GND
90
PEX_TX7
5
PWR_SRC
6
1V8RUN
91
PEX_RX6#
92
GND
7
PWR_SRC
8
1V8RUN
93
PEX_RX6
94
PEX_TX6#
9
PWR_SRC
10
1V8RUN
95
GND
96
PEX_TX6
11
PWR_SRC
12
1V8RUN
97
PEX_RX5#
98
GND
13
PWR_SRC
14
1V8RUN
99
PEX_RX5
100
PEX_TX5#
15
PWR_SRC
16
RUNPWROK
101
GND
102
PEX_TX5
17
GND
18
5VRUN
103
PEX_RX4#
104
GND
19
GND
20
GND
105
PEX_RX4
106
PEX_TX4#
21
GND
22
GND
107
GND
108
PEX_TX4
23
GND
24
GND
109
PEX_RX3#
110
GND
25
KEY
26
KEY
111
PEX_RX3
112
PEX_TX3#
27
KEY
28
KEY
113
GND
114
PEX_TX3
29
KEY
30
KEY
115
PEX_RX2#
116
GND
31
KEY
32
KEY
117
PEX_RX2
118
PEX_TX2#
33
KEY
34
KEY
119
GND
120
PEX_TX2
35
KEY
36
KEY
121
PEX_RX1#
122
GND
37
PEX_RX15#
38
PRSNT2#
123
PEX_RX1
124
PEX_TX1#
39
PEX_RX15
40
PEX_TX15#
125
GND
126
PEX_TX1
41
GND
42
PEX_TX15
127
PEX_RX0#
128
GND
43
PEX_RX14#
44
GND
129
PEX_RX0
130
PEX_TX0#
45
PEX_RX14
46
PEX_TX14#
131
GND
132
PEX_TX0
47
GND
48
PEX_TX14
133
PEX_REFCLK#
134
PRSNT1#
49
PEX_RX13#
50
GND
135
PEX_REFCLK
136
TV_C/HDTV_Pr
51
PEX_RX13
52
PEX_TX13#
137
CLK_REQ#
138
GND
53
GND
54
PEX_TX13
139
PEX_RST#
140
TV_Y/HDTV_Y
55
PEX_RX12#
56
GND
141
RSVD
142
GND
57
PEX_RX12
58
PEX_TX12#
143
RSVD
144
TV_CVBS/HDTV_Pb
59
GND
60
PEX_TX12
145
SMB_DAT
146
GND
61
PEX_RX11#
62
GND
147
SMB_CLK
148
VGA_RED
63
PEX_RX11
64
PEX_TX11#
149
THERM#
150
GND
65
GND
66
PEX_TX11
151
VGA_HSYNC
152
VGA_GRN
67
PEX_RX10#
68
GND
153
VGA_VSYNC
154
GND
69
PEX_RX10
70
PEX_TX10#
155
DDCA_CLK
156
VGA_BLU
71
GND
72
PEX_TX10
157
DDCA_DAT
158
GND
73
PEX_RX9#
74
GND
159
IGP_UCLK#
160
LVDS_UCLK#
75
PEX_RX9
76
PEX_TX9#
161
IGP_UCLK
162
LVDS_UCLK
77
GND
78
PEX_TX9
163
GND
164
GND
79
PEX_RX8#
80
GND
165
RSVD
166
LVDS_UTX3#
81
PEX_RX8
82
PEX_TX8#
167
RSVD
168
LVDS_UTX3
83
GND
84
PEX_TX8
169
RSVD
170
GND
85
PEX_RX7#
86
GND
171
IGP_UTX2#
172
LVDS_UTX2#
SP-01106-001_v1.0
35 05/14/04
MXM Electromechanical Specification
Pin# Signal Name
Pin#
Signal Name
Pin# Signal Name
Pin#
Signal Name
173
IGP_UTX2
174
LVDS_UTX2
207
208
LVDS_LTX1#
175
GND
176
GND
IGP_LTX1# / DVI_B_TX1#
177
IGP_UTX1#
178
LVDS_UTX1#
209
IGP_LTX1 / DVI_B_TX1
210
LVDS_LTX1
179
IGP_UTX1
180
LVDS_UTX1
211
GND
212
GND
181
GND
182
GND
213
214
LVDS_LTX0#
183
IGP_UTX0#
184
LVDS_UTX0#
IGP_LTX0# / DVI_B_TX0#
185
IGP_UTX0
186
LVDS_UTX0
215
LVDS_LTX0
GND
188
GND
IGP_LTX0 / DVI_B_TX0
216
187 189
IGP_LCLK# / DVI_B_CLK#
190
LVDS_LCLK#
217
DVI_A_HPD
218
GND
219
DVI_A_CLK#
220
DDCC_DAT
191
IGP_LCLK / DVI_B_CLK
192
LVDS_LCLK
221
DVI_A_CLK
222
DDCC_CLK
223
GND
224
LVDS_PPEN
DVI_B_HPD / GND
194
225
DVI_A_TX2#
226
LVDS_BL_BRGHT
195
RSVD
196
LVDS_LTX3#
227
DVI_A_TX2
228
LVDS_BLEN
197
RSVD
198
LVDS_LTX3
229
GND
230
DDCB_DAT
199
GND
200
GND
231
DVI_A_TX1#
232
DDCB_CLK
201
IGP_LTX2# / DVI_B_TX2#
202
LVDS_LTX2#
233
DVI_A_TX1
234
2V5RUN
235
GND
236
GND
203
IGP_LTX2 / DVI_B_TX2
204
LVDS_LTX2
237
DVI_A_TX0#
238
3V3RUN
GND
206
239
DVI_A_TX0
240
3V3RUN
241
GND
242
3V3RUN
193
205
SP-01106-001_v1.0
GND
GND
36 05/14/04
MXM Electromechanical Specification
Connector Pin Descriptions Table 5 contains pin descriptions for each signal type. All Input/Output classifications are relative to the MXM graphics module.
Table 5.
Connector Pin Descriptions
Signal Name
Input/Output
Description
DVI_A_TX0-2, DVI_A_TX0-2#
Output, 100 Ohm Diff
TMDS output for either single link DVI or dual link DVI
DVI_A_CLK, DVI_A_CLK#
Output, 100 Ohm Diff
TMDS clock for either single link DVI or dual link DVI
DVI_A_HPD
Input
DVI hot plug detect for DVI_A
DVI_B_TX0-2, DVI_B_TX0-2#
Output, 100 Ohm Diff
TMDS output for either single link DVI or dual link DVI, upper bits for dual-link. Note: these pins are shared with IGP LVDS loop through pins
DVI_B_CLK, DVI_B_CLK#
Output, 100 Ohm Diff
TMDS clock, only used for second single-link DVI. Note: these pins are shared with IGP LVDS loop through pins
DVI_B_HPD
Input/GND
DVI hot plug detect for DVI_B. Tie to GND on motherboard if notebook is configured for IGP LVDS pass through
DDCA_CLK
Output, 3.3 V logic levels 2.2K Pull-up required on MXM graphics module
Serial link, can connect to VGA, DVI_A or DVI_B. Configuration needs to be stored in MXM system information.
DDCA_DAT
BI-Directional 3.3 V logic levels 2.2K Pull-up required on MXM graphics module,
Serial link, can connect to VGA, DVI_A or DVI_B. Configuration needs to be stored in MXM system information.
DDCB_CLK
Output, 3.3 V logic levels 2.2K Pull-up required on MXM graphics module
Serial link, can connect to VGA, DVI_A or DVI_B. Configuration needs to be stored in MXM system information.
DDCB_DAT
BI-Directional 3.3 V logic levels 2.2K Pull-up required on MXM graphics module
Serial link, can connect to VGA, DVI_A or DVI_B. Configuration needs to be stored in MXM system information.
LVDS_PPEN
Output, 3.3 V logic levels
LVDS Panel Power enable
LVDS_BLEN
Output, 3.3 V logic levels
LVDS Panel backlight enable
LVDS_BL_BRGHT
PWM Output, 3.3 V logic levels
LVSD Panel brightness control, duty cycle determines output level
LVDS_UTX0-3, LVDS_UTX0-3#
Output, 100 Ohm Diff
LVDS output for dual link
IGP_UTX0-2, IGP_UTX0-2#
Input, 100 Ohm Diff
LVDS input that loops back to LVDS_UTX02, LVDS_UTX0-2# to provide path for LVDS with IGP only.
LVDS_UCLK, LVDS_UCLK#
Output, 100 Ohm Diff
LVDS clock for dual link
SP-01106-001_v1.0
37 05/14/04
MXM Electromechanical Specification
Signal Name
Input/Output
Description
IGP_UCLK, IGP_UCLK#
Input, 100 Ohm Diff
LVDS input that loops back to LVDS_UCLK, LVDS_UCLK# to provide path for LVDS with IGP only.
LVDS_LTX0-3, LVDS_LTX0-3#
Output, 100 Ohm Diff
LVDS output for either single link or dual link
IGP_LTX0-2, IGP_LTX0-2#
Input, 100 Ohm Diff
LVDS input that loops back to LVDS_LTX02, LVDS_LTX0-2# to provide path for LVDS with IGP only. Note: these pins are shared with DVI_B pins
LVDS_LCLK, LVDS_LCLK#
Output, 100 Ohm Diff
LVDS clock for either single link or dual link
IGP_LCLK, IGP_LCLK#
Input, 100 Ohm Diff
LVDS input that loops back to LVDS_LCLK, LVDS_LCLK# to provide path for LVDS with IGP only. Note: these pins are shared with DVI_B pins
TV_Y/HDTV_Y
Output, 37.5 Ohm +/- 2 Ohms
TV_OUT Luma/HDTV_OUT Luma
TV_C/HDTV_Pr
Output, 37.5 Ohm +/- 2 Ohms
TV_OUT Chroma/HDTV_OUT
TV_CVBS/HDTV_Pb
Output, 37.5 Ohm +/- 2 Ohms
TV_OUT Composite/HDTV_OUT Chroma Blue
DDCC_CLK
Output, 3.3 V logic levels 2.2K pull-up required on motherboard
Serial link, connect to EDID LVDS Panel and to MXM System Information ROM. This link is not to be used for external interfaces
DDCC_DAT
BI-Directional 2.2K pull-up required on motherboard
Serial link, connect to EDID LVDS Panel and to MXM System Information Rom. This link is not to be used for external interfaces
VGA_BLU
Output, 37.5 Ohm +/- 2 Ohms
VGA Blue Output
VGA_RED
Output, 37.5 Ohm +/- 2 Ohms
VGA Red Output
VGA_GRN
Output, 37.5 Ohm +/- 2 Ohms
VGA Green Output
VGA_HSYNC
Output, 3.3 V logic levels
VGA Horizontal Sync
VGA_VSYNC
Output, 3.3 V logic levels
VGA Vertical Sync
SMB_CLK
Input, 5 V tolerant
Serial link for thermal sensor on GPU. Connect to motherboard's SMBus Clock signal.
SMB_DAT
Bi-Dir, 5 V tolerant
Serial link for thermal sensor on GPU. Connect to motherboard's SMBus Data signal.
THERM#
Open Collector Output, active low, 5 V tolerant
Indicates a thermal alert. Connect to motherboard's SMBus Alert signal.
PRSNT1#
GND
Card present detect, indicates if MXM graphics module is present. Tie to pull-up on motherboard. If high then MXM is not present. If low then MXM is present. Can be used to control IGP upgrade multiplexers
PRSNT2#
GND
Tied to Ground on both motherboard and MXM. Reserved for future functionality.
SP-01106-001_v1.0
Chroma Red
38 05/14/04
MXM Electromechanical Specification
Signal Name
Input/Output
Description
CLK_REQ#
Output, active low
Indicates need for PEX_REFCLK
PEX_RST#
Input, active low
PCI_Express reset
PEX_REFCLK, PEX_REFCLK#
Input, 100 Ohm Diff
PCI Express reference clock.
PEX_TX0-15, PEX_TX0-15#
Input, 100 Ohm Diff
PCI Express 16 lanes, output from northbridge. DC blocking capacitiors need to be placed on the motherboard.
PEX_RX0-15, PEX_RX0-15#
Output, 100 Ohm Diff
PCI Express 16 lanes, input to northbridge. DC blocking capacitors need to be placed on the MXM graphics module.
RUNPWROK
Input
Indicates that all power to the MXM is within the specified tolerances
3V3RUN
Power input
3.3 V run power
5VRUN
Power input
5 V run power
2V5RUN
Power input
2.5 V run power
1V8RUN
Power input
1.8 V run power
PWR_SRC
Power input
Battery power
Power Requirements The Mobile PCI Express Module (MXM) requires the following power to be provided by the notebook (Table 6).
Table 6.
Power Requirements
Voltage Rail 3V3RUN
Voltage
Current
Power
Notes
3.3 V +/- 5%
1.5 Amps
4.95 W
3.3 V run
5VRUN
5 V +/- 5%
0.5 Amps
2.5 W
5 V run
2V5RUN
2.5 V +/- 5%
0.5 Amps
1.25 W
2.5 V run
1V8RUN
1.8 V +/- 5%
3.5 Amps
6.3 W
1.8 V run
PWR_SRC
7.5 V* to 22 V
Up to 4 Amps
8.9 W to 38.9 W
Battery, store power capability in MXM system information.
* For a platform MXM input budget greater than 30 W, the minimum PWR_SRC voltage is input budget/4A. For example, an input budget of 35 W, the PWR_SRC Vmin = 8.75 V
SP-01106-001_v1.0
39 05/14/04
MXM Electromechanical Specification
Power Throttling The MXM will automatically detect power supply limitations and thermal limitations of the notebook platform and will automatically throttle its clocks to stay within the power and thermal limits. If the notebook platform’s power supply and MXM thermal cooler are equal too or exceeds the MXM’s power requirements, the MXM will run at full speed. The MXM system information data contains the necessary information for MXM throttling. This data is stored in either the SBIOS or the MXM system information ROM on the Notebook’s motherboard.
System Requirements Display Requirements Panel Type The MXM system only supports EDID Panels.
LVDS Panel Power The motherboard shall provide power to the notebook’s LVDS panel. The power is optionally controlled by LVDS_PPEN.
VGA, TV_Out Impedance The motherboard shall route all RGB signals and TV_OUT signals with 37.5 Ohms impedance. A 75 Ohm termination resistor shall be placed at the end of the trace as close as possible to the output filters which should be as close as possible to the output connectors. For notebooks configured to support TV_Out, 75 Ohm termination resistors are required on any unused TV_Out signals. The MXM graphics module shall route all RGB signals and TV_OUT signals with 37.5 Ohms.
Output Filters The motherboard is required to have output filters on all VGA output lines and on all TV output lines. These filters should be placed as close as possible to the external connectors.
SP-01106-001_v1.0
40 05/14/04
MXM Electromechanical Specification
Other Requirements MXM System Information ROM The motherboard is required to store the MXM System Information in either the SBIOS or in the MXM System Information ROM. The implementation is a design decision left to the system provider’s discretion. Information regarding the data stored in the MXM System Information is found in the MXM Software Specification. For MXM System Information ROM implementations, the Motherboard is required to place a 256 Byte serial ROM that connects to DDCC_CLK and DDCC_DAT with a device address of 0xAC. The ROM must be compatible to an Atmel 24C02 and operate with 3.3 V signaling
5 V Tolerance The motherboard shall provide back drive isolation and level shifting for all DDC lines, VGA_HSYNC and VGA_VSYNC. The MXM graphics modules do not drive output signals at 5 V output levels and its inputs are not 5 V tolerant unless specifically stated.
DVI_B/IGP_LVDS Pin Sharing The MXM must not power up DVI_B interfaces until it has verified that the notebook is configured for DVI_B. This information will be stored in the MXM system information ROM. IGP LVDS pass through and DVI_B can not co-exist in the same notebook, they are mutually exclusive. When configured for IGP LVDS pass through, DVI_B_HPD must be tied to GND on the motherboard.
DVI Detection Circuitry The motherboard is required to have input filters on both DVI_HPD lines. The MXM graphics module is required to provide level shifting and clamping for these signals.
MXM Cooling Fan If it is necessary for the MXM graphics module to have its own dedicated fan in the notebook’s chassis, the motherboard is required to provide power and speed control for the fan.
MXM Grounding The MXM graphics module is grounded through the MXM connector and the two mounting holes. The thermal solution will be grounded through the thermal mounting holes and the landing area around the holes.
SP-01106-001_v1.0
41 05/14/04
MXM Electromechanical Specification
Power Up Sequencing There is no requirement for power up sequencing on the motherboard to support MXM graphics modules. If power up sequencing is required, each MXM graphics module is responsible for its own power up sequencing.
Additional Function Support In order to facilitate additional functions implemented with GPIOs not supported in this specification, such as Japan-D connector or multiplexing TV out to separate connectors for Component out and S-Video, the motherboard is required to place a serial link GPIO Expander that connects to DDCC_CLK and DDCC_DAT with a device address of 0x4C. This address allows the motherboard designer to utilize GPIO and ROM combination devices to reduce overall implementation costs. The specific function of each GPIO shall be stored in the MXM System Information Structure. The MXM System Information Structure is found in the MXM Software Specification.
SP-01106-001_v1.0
42 05/14/04
Appendix: Support Information
Configuring Notebook for MXM with IGP Configurable Option Use of the MXM platform will allow maximum flexibility in configuring different graphics capabilities all with the same motherboard. Through the use of zero Ohm stuffing resistors the manufacturer can easily decide if the notebook will be configured with an IGP or a MXM graphics module all with the same motherboard platform. Refer to Figure 25 for the notebook output topology with IGP.
SP-01106-001_v1.0
43 05/14/04
MXM Electromechanical Specification
Figure 25.
Notebook Output Topology with IGP
Upgradeable Option To facilitate possible upgrades to the notebook a LVDS pass through feature was added to the MXM system. This pass through capability was needed since active devices that work at LVDS data rates are very expensive. To support LVDS pass through, the IGP’s LVDS output signals will need to be routed over to the MXM connector and connect to the IGP_LVDS signals. An extremely low cost passive PCB will be inserted into the MXM connector that will complete the circuit path between the IGP’s output signals and the LVDS panel input signals. VGA and TV_out signals are switched by an active device between the IGP and MXM. When a MXM is installed at a later date the Mux will switch over to the MXM output signals and the MB_LVDS signals will be interrupted by the MXM card. If PRSNT#1 is low then the MUX will connect the VGA and TV circuit paths to the MXM. If DVI is supported on an IGP platform, the TMDS transmitter will reside on the LVDS pass through card and drive TMDS outputs on DVI_A signals. The IGP would need to multiplex TMDS data over PCI Express lines. See Figure 26
Figure 26.
SP-01106-001_v1.0
Notebook Output Topology with IGP
44 05/14/04
Notice ALL NVIDIA DESIGN SPECIFICATIONS, REFERENCE BOARDS, FILES, DRAWINGS, DIAGNOSTICS, LISTS AND OTHER DOCUMENTS (TOGETHER AND SEPARATELY, "MATERIALS") ARE BEING PROVIDED "AS IS." NVIDIA MAKES NO WARRANTIES, EXPRESSED, IMPLIED, STATUTORY OR OTHERWISE WITH RESPECT TO THE MATERIALS, AND EXPRESSLY DISCLAIMS ALL IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE.
Information furnished is believed to be accurate and reliable. However, NVIDIA Corporation assumes no responsibility for the consequences of use of such information or for any infringement of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of NVIDIA Corporation. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. NVIDIA Corporation products are not authorized for use as critical components in life support devices or systems without express written approval of NVIDIA Corporation. Trademarks NVIDIA, the NVIDIA logo and MXM Graphics Module, are trademarks of NVIDIA Corporation in the United States and other countries. Other company and product names may be trademarks of the respective companies with which they are associated. Copyright © 2004 by NVIDIA Corporation. All rights reserved
NVIDIA Corporation 2701 San Tomas Expressway Santa Clara, CA 95050 www.nvidia.com
Related Documents
Mxm Electro Spec
February 2021 2
Spec
March 2021 0
Substation Spec
January 2021 1
Electro Stimulation
January 2021 1
Ejercicios Electro
February 2021 1
Gustavo_bernard_s4 Electro
February 2021 1More Documents from "Kako M. Bernard Caceres"
Mxm Electro Spec
February 2021 2
Android Apps Spezial 2 Klein Wu23as
February 2021 0
Computones Vol. 5
January 2021 1
Computones Vol. 2
January 2021 1
Alan Moore's Writing For Comics 1
March 2021 0